Syenta’s Localized Electrochemical Manufacturing (LEM) introduces a breakthrough in semiconductor interconnect technology by enabling direct, additive copper deposition at micron and sub-micron scales. Unlike conventional subtractive and lithography-heavy methods, LEM delivers high-density redistribution layers (RDL), HBM attach, and advanced packaging interconnects with lower cost, faster cycle time, and reduced material waste. This drop-in, IP-driven process integrates seamlessly with existing OSAT and foundry flows, offering a scalable solution to the interconnect bottleneck that limits AI, HPC, and heterogeneous integration roadmaps. By removing dependency on scarce packaging capacity, LEM provides a sustainable path to higher bandwidth, improved performance, and resilient supply chains.
