Defects are now approaching the single-digit nanometer scale, making them increasingly difficult to detect and measure with traditional metrology and inspection tools. icspi has developed a scalable atomic force microscope (AFM) on a 1 mm² MEMS chip; miniaturizing AFM by a factor of 1,000,000. MicroAFM enables a new approach to semiconductor metrology and inspection: by using parallel arrays of thousands of microAFMs, icspi’s technology delivers unprecedented wafer coverage and throughput with sub-nanometer resolution, enabling the detection of critical defects, faster time-to-yield, and reduced scrap.
