The exponential rise in demand for high-performance electronics, driven by data centers, AI, and advanced computing, has exposed a critical bottleneck: thermal management. Today, 30–40% of data center energy is consumed by cooling. This problem starts at the foundation of all devices. PCBs are reinforced with glass-fibers, which restrict heat dissipation, leading to overheating, reliability issues, and escalating energy costs. Flexiramics has developed a breakthrough flexible ceramic material that acts as a drop-in replacement for glass fibers in PCB substrates, delivering superior thermal conductivity and reduced signal loss. This innovation enables up to 30% lower cooling energy consumption, extends component lifespans by 50%, and significantly cuts carbon emissions. A typical 20 MW data center could save over €1M annually while reducing its CO₂ footprint by 5 kilotons. This talk will explore the technology foundation, and customer adoption pathway for flexible ceramics as a transformative enabler for the semiconductor industry.
