The convergence of cloud computing and AI is fundamentally transforming how silicon is designed, manufactured, and deployed at scale. In this keynote, Selim Bilgin, CVP of Silicon Engineering at Microsoft, will share Microsoft’s vision for the future of silicon innovation—where custom silicon, advanced packaging, and AI-optimized systems are at the heart of next-generation cloud infrastructure.
Discover how Microsoft is reimagining the entire silicon lifecycle, from architecture and manufacturing to deployment in hyperscale datacenters. The session will explore how vertical optimization—spanning algorithmic efficiency, memory, networking, and advanced packaging—enables Microsoft to deliver unprecedented performance, reliability, and sustainability for AI workloads. Learn how innovations such as chiplet-based architectures, heterogeneous integration, and intelligent manufacturing flows are overcoming the limits of traditional scaling, while new approaches to power, cooling, and rack design are redefining what’s possible in the AI era.
Attendees will gain insight into how Microsoft’s silicon strategy is driving total cost of ownership (TCO) efficiency, accelerating time to market, and empowering customers to achieve more in a rapidly evolving digital landscape.
