Skip to main content
SEMICON West 2025 Main banner

    Heterogeneous Integration

    Advanced Packaging

    IEEE - IRDS Packaging Integration – History & Roadmap for AI 

    Advanced Lithography for Dense Package Interconnects on Large Panels

    Tuesday, October 7, 2025
    4:15pm - 4:40pm MT
    Location: West Building, 100 Level, Room 105 BC