Skip to main content
SEMICON West 2025 Main banner

    Rozalia Beica

    Field CTO Packaging Technology
    Rapidus Design Solutions
    Santa Clara, CA, United States

    Rozalia Beica is a global leader in semiconductor and advanced packaging, with over 25 years of international experience in technology development, business strategy, and ecosystem building. She has held executive roles at Applied Materials, Lam Research, DuPont, AT&S, and Yole Développement. Her leadership has shaped global technology roadmaps, commercialization strategies, and market entry plans, directly contributing to packaging innovation and growth in emerging markets. She currently serves as Field CTO of Packaging Technologies at Rapidus Design Solutions.

    A recognized thought leader, Rozalia has delivered over 175 invited talks and keynotes, and led major industry initiatives including EMC3D Consortia, ECTC, IMAPS Device Packaging, and SEMI’s Strategic Materials Conference. She currently chairs the IMAPS Silicon Valley Chapter and the IEEE HIR Wafer-Level Packaging Technical Working Group. Rozalia has received numerous awards, including the 2006 R&D 100 Award, and was the first recipient of the IMAPS Leadership Award in 2020.

    A visionary entrepreneur, Rozalia sits on the advisory boards of Terecircuits and Thintronics and has led initiatives supporting start-up competitions to connect emerging ventures with investors and industry leaders. Her advisory and governance roles span across IEEE EPS, IMAPS, IMPACT Taiwan, and other international organizations, reflecting her global influence and commitment to advancing semiconductor packaging technologies. Rozalia holds an Executive MBA and M.Sc. degrees in Chemical Engineering and Technology Management, and is a strong advocate for diversity, entrepreneurship, and global collaboration in deep tech.

    Presentation(s):