Manufacturing Test Technologist
Amkor Technology, Inc.
Tempe, AZ, United States
Vineet joined Amkor in Jan. 2019 and currently leads test technology development and deployment for 2.5D/3D Advanced Packages, 5G RF and high-speed digital production test methodologies. Before joining Amkor, Vineet worked at Microchip Technology for 6 years and Intel Corporation for 19 years. At Microchip, he was the lead test content developer for 8 and 16bit microcontrollers with a variety of Analog and Mixed Signal peripherals. At Intel, he held a variety of test roles, including tester supplier management, test technology development for burn-in, final and system level test. He owned the Burn In Platform’s Electrical sub-system and architected the RF tester architecture for the organically developed Test Platform. Vineet holds a patent on semiconductor device testers and has earned master’s degrees in physics and electrical engineering from Arizona State University.
High Performance Compute: Advanced Packaging Impacts to Test Equipment
Wednesday, October 8, 2025
3:10pm - 5:00pm MT
Manufacturing Test Challenges for Co-Packaged Optics
Thursday, October 9, 2025
2:00pm - 2:15pm MT