CVP of Heterogeneous Integration Technologies
AMD
Austin, TX, United States
Dr. Raja Swaminathan is the Corporate Vice President of Heterogeneous Integration Technologies at AMD, spearheading the development of AMD's advanced packaging and heterogeneous integration roadmap. He also leads the Optics technology development at AMD, driving innovation in high-speed optical interconnects and photonics integration.
With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan's expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple's Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators.
Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to his name, he was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology. He also shares his insights on life and leadership, drawing lessons from the semiconductor industry, on his LinkedIn profile.
Future of AI Hardware Enabled by Advanced Packaging
Wednesday, October 8, 2025
11:00am - 11:25am MT
Panel Discussion and Audience Q&A
Wednesday, October 8, 2025
11:25am - 12:25pm MT